| 摘要 |
PURPOSE:To enable heat which is generated by a semiconductor element which is mounted on a substrate to be efficiently transferred to a cooling member for cooling without applying an excessive load even if a height of the semiconductor elements scatters. CONSTITUTION:A wiring circuit board 2 where a number of semiconductor elements 1 are mounted is encapsulated in a flexible film 6 which is formed in bag shape together with a cooling medium 3 and a cooling member 8 is pressed against an outside of the flexible film 6. A temperature difference of the cooling medium 3 between a surface of the semiconductor elements 1 and a surface where the cooling member 8 is pressed against allows convection to be induced and heat which is generated in the semiconductor elements 1 to be transferred to the cooling member 8. The semiconductor elements 1 with various heights are mounted on the wiring circuit board 2. However, cooling can be made regardless of various heights and without applying an excessive load to the wiring circuit board 2 and the semiconductor elements 1. Furthermore, cooling can be performed on a wide surface where the cooling member 8 is pressed against even if only a specific semiconductor is releasing heat partially. |
