| 摘要 |
PURPOSE:To obtain a manufacturing method of electronic component wherein alignment precision is improved, a demagnification projection aligner, an electron beam and an X-ray lithographic equipments, and which are used for said method, and a wafer which is used for them. CONSTITUTION:In the manufacturing process of electronic parts like a semiconductor device, alignment in the initial lithography process is performed by using an alignment mark 21 on the rear, and an alignment mark 22 is formed also on the surface at the same time as the pattern formation. In the later process, alignment is performed at least one time by using the alignment mark 22 on the surface. A reduction stepper, an electron beam and an X-ray lithograghic equipments have a rear position detection optical system for a wafer and a surface position detection system using light, an electron beam and an X-ray beam. |
