| 摘要 |
PURPOSE:To enable a laminated board small in thickness to be lessened in dimensional change and warpage in and after a process where the laminate boards are formed into a multilayered board by a method wherein fiber base material is impregnated with resin, dried up, and controlled in resin component to form a prepreg, and an inner circuit is formed of only a single sheet, of prepreg. CONSTITUTION:A circuit is formed on a single side or both the sides of an insulating layer composed of a fiber base material and matrix resin to form an inner circuit board, and an outer copper foil is bonded to the inner circuit board into one piece through the intermediary of an adhesive insulating layer composed of fiber base material and matrix resin for the formation of a metal foil plated laminated board. For instance, glass cloth 0.2mm in thickness is used as fiber base material, epoxy resin is employed as matrix resin, and an adhesive insulating layer is formed of prepreg composed of two sheets of glass fiber base material 0.1mm in thickness and epoxy resin or a sheet of glass fiber base material 0.15mm in thickness and epoxy resin. The insulating layer of an inner circuit board is formed of glass cloth base material prepreg 37-43% in resin component and 0.2mm in thickness. By this setup, laminated boards can be lessened in dimensional change in a process where they are formed into a multilayered laminated board. |
