发明名称 |
METALLIZED PATHS ON DIAMOND SURFACES |
摘要 |
METALLIZED PATHS ON DIAMOND SURFACES A graphite path is formed along the surface of a diamond plate, preferably a CVD diamond plate, by means of a laser. The path advantageously canbe the surface of a sidewall of a via hole drilled by the laser through the plate or a path running along a side surface of the plate from top to bottom opposed major surfaces of the plate. The graphite path is metallized, as by electroplating. In this way, for example, an electrically conducting connection can be made between a metallized backplane located on the bottom surface of the plate and a wire-bonding pad located on the top surface of the plate. |
申请公布号 |
CA2084147(A1) |
申请公布日期 |
1993.06.12 |
申请号 |
CA19922084147 |
申请日期 |
1992.11.30 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
DAUTREMONT-SMITH, WILLIAM C.;FELDMAN, LEONARD C.;KALISH, RAFAEL;KATZ, AVISHAY;MILLER, BARRY;MORIYA, NETZER |
分类号 |
C01B31/06;H01L21/203;H01L21/48;H01L21/52;H01L23/12;H01L23/373;H01S3/00;H05K3/10;(IPC1-7):C25D7/12;C25D5/02 |
主分类号 |
C01B31/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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