| 摘要 |
<p>The system is designed to cool average dissipation multichip modules. The heat conducting cover (3) associated with the substrate (1) supporting the circuits (2a, 2b, 2c, ...) coperates with flexible, low heat-resistant metal devices (5a, 5b, 5c, ...) for transferring heat from the circuits to the cover. The contact surfaces of the devices (5a, 5b, 5c, ...) are flat and have a flat/rough surface state for controlling air layers in the region of the contacts. The system offsets differences in altitude and angles between the substrate and the various circuits and diminishes thermal resistance in the region of the contacts. Application in average dissipation multichip module cooling.</p> |
