| 摘要 |
<p>PURPOSE:To enhance the noise absorbing effect, and to miniaturize the title solid state relay by a method wherein an electrode of chip type nose absorbing element is connected between output terminals and they are formed into an integral structure. CONSTITUTION:The title solid state relay is composed of an input-side light- emitting element 1, light driving type semiconductor elements 2 and 3, translucent resin 8, a substrate 9, non-light transmitting resin 10, which becomes a housing, a noise absorbing element 15 and the like. A wide-width part 14a, extending toward sideways, is integrally formed on the intermediate part of an output terminal, one of electrodes of the noise-absorbing element 15 is connected to the upper surface of the wide-width part 14a in an electrically stabilized state. Also, the other electrode part of the noise-absorbing element 15 is electrically connected to the extended part 13a which is bent and extending from the other output terminal 13. The noise-absorbing element 15 consists of an almost column-shaped chip-like varistor, and an Al electrode, which is connected to both surfaces of the output terminals 13 and 14, is formed. As the varistor consists of a chip component, the whole body of the title solid-state relay can be made small in size.</p> |
