| 摘要 |
PURPOSE:To peel off the resin sticking to and remaining on the lead frame hardened in a resin path by providing a through hole for peeling off the void parts made in the lead frame by thrusting them with a punch after molding the lead frame with resin. CONSTITUTION:When a lead frame 10 is filled up with resin, a liner 16 extends in lateral direction from the edge of the lead frame 10, and curves obliquely halfway, and communicates with one corner of a resin corner 12. The liner 16 extends onto the lead frame 10 along the bottom of the lead frame 10, and the straight line leading to the resin mold part 12 is a gate. Through holes 18a and 18b are bored in advance in a lead frame 10, according to the position where a linear passage passes when molding the lead frame 10 with resin. The peeling of the linear 10 and a gate 14 are performed by thrusting the projections 20a and 20b projecting from the topside of the lead frame 10 with a punch 30. |
