| 摘要 |
PURPOSE:To prevent a wire breaking from occurring in an upper-layer wiring and connect the upper-layer wiring with a lower-layer wiring certainly. CONSTITUTION:A pillar-shaped wiring 3 for connection is erected at one section of the lower-layer wiring 2 made on the surface of a circuit board 1 by a laser CVD. Moreover an interlayer insulating film 4 is made on the surface of the circuit board 1, covering the lower-layer wiring 2 and exposing the top end face of the wiring 3 for connection. An upper-layer wiring 5 connected to the top end face of wiring 3 for connection is made at the surface of the interlayer insulating film 4. The upper-layer wiring 5 is connected to the lower-layer wiring 2 through the wiring 3 for connection. Since the upper-layer wiring 5 gets in nearly flat condition, the fear of breaking of the upper-layer wiring 5 vanishes, and also the lower-layer wiring 2 and the wiring 3 for connection are connected certainly by forming the interlayer insulating film 4 after formation of the wiring 3 for connection. |
