| 摘要 |
PURPOSE:To improve resist adhesion to a copper foil glossy surface, and obtain a processing method wherein characteristics like heat resistant oxidation and solder wettability are not deteriorated. CONSTITUTION:A coating layer containing zinc and/or zinc oxide, oxide of chrome, and nickel is formed on at least the glossy surface of a copper foil. Electrolytic plating is performed by using plating solution containing zinc salt and/or zinc oxide, chromate, and nickel salt. The desirable amount of adhesion is obtained by the following; Zn:60-80mug/dm<2>, Cr:30-40mug/dm<2> and Ni:5-20mug/dm<2>. A treat processing for forming one or more kinds of single metal layers or alloy layers selected out of Cu, Cr, Ni, Fe, Co and Zn can be applied to the roughened surface formation of the copper foil. Discoloration is not generated under a high temperature condition of 180 deg.CX30min, resist adhesion is excellent, and formation of narrow circuit width is possible. |
