| 摘要 |
PURPOSE:To make it possible to completely fill narrow gaps between wiring conductors with insulating resin without unfilled areas and voids by introducing the insulating resin into a cavity by the evacuation of the inside of the cavity through an air inlet/outlet port of an upper mold and pressurizing the inside of the cavity higher than a vapor pressure of a volatile constituent in the resin. CONSTITUTION:After the inside of a cavity 24 is evacuated by the connection of a vacuum pump to an air inlet/outlet port 19, a tablet 81 is introduced into the inside of the cavity 24 by lowering a plunger 13. However, the vacuum suction obstructs the pressure of molten resin from rising, the inside of the cavity 24 is filled with the resin, and the resin rises to the inside of an overflow section 15. For this reason, after the inside of the cavity 24 is brought back to atmospheric pressure by interrupting the evacuation, an inactive gas such as air, nitrogen gas, carbon gas or the like is introduced through the air inlet/ outlet port 19, and the pressure of the inside of the cavity including the overflow section 15 is set to 5-10kg/cm<2>. Since the molten resin also undergoes this pressure, a volatile constituent in the resin will not vaporize, whereby the occurrence of voids can be suppressed. |
