SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To prevent roundabout of molding resin underneath a state in a molding step. CONSTITUTION:A method for manufacturing a semiconductor device comprises the steps of fixing a chip 3 to a stage of a lead frame having a fixing part 9 extended in a planar direction of the stage 1 for placing the chip to wire bond the leads 5 of the frame to the chip, setting the lead frame for placing the chip to a cavity formed of an upper mold 10 having a protrusion 8 provided at a position corresponding to the fixing part and a lower mold 11 to retain the stage of the frame to the lower mold by pressing the protrusion to the fixing part, and resin-sealing the frame by feeding the resin to the cavity.