PRODUCTION OF THICK-FILM PRINTED CIRCUIT BOARD

摘要

PURPOSE:To easily produce a thick-film printed circuit board having an optional air-bridge structure suitable for a high-frequency circuit by adopting a borosilicate-zinc-based glass for the insulation layer (insulator) in which printed circuit patterns cross stereoscopically. CONSTITUTION:A borosilicate-zinc-based glass paste is printed by a screen print method on an area surface where a second printed circuit after crosses on a specified area surface of a first printed circuit pattern. Then it is burned in a nitrogen atmosphere to form an optional cross insulator 7. After the second printed circuit pattern has been formed, the borosilicate-zinc-based glass constituting the insulator 7 is melt and removed. Thus a thick-film printed circuit board having an air-bridge structure can be easily obtained.