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发明名称
METHOD FOR POLISHING BACK OF WAFER
摘要
申请公布号
JPH05315304(A)
申请公布日期
1993.11.26
申请号
JP19920117817
申请日期
1992.05.12
申请人
SONY CORP
发明人
KENMOTSU HIDENORI
分类号
H01L21/304;H01L21/301;H01L21/78;(IPC1-7):H01L21/304
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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