| 摘要 |
PURPOSE:To improve the reliability of an interlayer connection, and to facilitate a change of the connection in a type of multilayer interconnection board in which an interlayer connection is effected by inserting a conductive pin into a through-hole formed in a multilayer interconnection board. CONSTITUTION:Substrate resin layers 1 surrounding a through-hole 2 are degenerated by dissolution or the like, which, in turn, causes patterns 3 to be relatively projected to the inside of the through-hole 2. Thereafter, a spring pin 6 is inserted into the through-hole 2, so that the pin comes into contact with the projections. |
