发明名称 DEVELOPING PROCESSING APPARATUS
摘要 PURPOSE:To provide a developing processing apparatus wherein the developing rate of each wafer can be made definite and the developing rate in the peripheral edge part of the wafer and that in its central part can be made uniform. CONSTITUTION:A water chuck 7 which is provided with a susceptor 11 on which a wafer 10 coated with a developing solution 24 is mounted is installed. A liquid passage 15 in which a liquid 25 used to adjust the temperature of the wafer 10 via the susceptor 11 is formed inside the susceptor 11. A temperature regulator 20 which adjusts the temperature of the liquid 25 housed inside the liquid passage 15 is installed. In addition, a cavity 27 in which a gas 32 used to adjust the temperature of the peripheral edge part of the wafer 10 is housed is formed around the susceptor 11. A temperature regulator 31 which adjusts the temperature of the gas 32 housed inside the cavity 27 is installed. Consequently, the developing rate of each wafer can be made definite, and the developing rate in the peripheral edge part 10b of the wafer 10 and that in its central part 10b can be made uniform.
申请公布号 JPH05335229(A) 申请公布日期 1993.12.17
申请号 JP19920138739 申请日期 1992.05.29
申请人 TOSHIBA CORP 发明人 NUNOTANI NOBUHITO;MATSUMOTO NATSUYO
分类号 G03F7/30;H01L21/027;H01L21/30;(IPC1-7):H01L21/027 主分类号 G03F7/30
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