| 摘要 |
PURPOSE:To easily peel off only the top layer resist in a three layer resist. CONSTITUTION:To easily peel off only the top layer resist 14 in the under layer resist 12, the intermediate layer 13 and the top layer resist 14 successively laminated on a substrate 11, a low conc. resolving resist 14 is used as the top layer resist. Thus, the top layer resist is easily removed by a conventional TMAH based developer of 2.38%. As a result, the top layer resist is easily reformed and the yield in semiconductor producing process is improved. |
