| 摘要 |
PURPOSE:To provide a method for connecting an LSI chip which is highly reliable, has an improved reproducibility, and can be extremely fine. CONSTITUTION:The title method features collective connection of an LSI chip 1 and a substrate 3 by forming a metal bump 5 at an electrode pad 2 or an electrode terminal 4, connecting continuity parts, forming a pattern with an activated energy ray curing resin at a non-continuity part using a lithography technology, and thermopressing and sealing the continuity and non-continuity parts simultaneously after alignment. Further, when a substrate is transparent to visible rays, a glare-protection material is used for an activated energy ray curing resin 6 for preventing malfunction of the LSI chip due to light. |
