发明名称 MULTILAYERED CIRCUIT BOARD AND ITS MANUFACTURE
摘要 PURPOSE:To improve the reliability of electric continuity of a conduction part for connecting wiring patterns, and manufacture a multilayered circuit board with high efficiency. CONSTITUTION:In a multilayered circuit board wherein a multilayered wiring patterns are formed interposing electrically insulative layers between layers, and conduction parts for electrically connecting the wiring patterns are formed between layers, the surface of an insulator wherein the conduction part disposed in upright in a post type on an insulative layer 16 is coated with a conductor metal film 22, the conductor metal film 22 of the tip of a post type body 20 of the conduction part is connected with one wiring pattern 28, and the conductor metal film 22 of the outer wall base part of the post type body is connected with the other wiring pattern 24.
申请公布号 JPH0629665(A) 申请公布日期 1994.02.04
申请号 JP19920207481 申请日期 1992.07.11
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KARAKIDA KAZUHIKO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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