| 摘要 |
Test data is written into respective semiconductor memory devices, e.g., EEPROMs formed on a wafer. Then, the semiconductor memory devices, still located on the wafer, are baked in a high-temperature atmosphere for a predetermined time. Examples of the baking temperature and time are 200 degrees C. and 8 hours. The test data is read from the respective semiconductor devices to check whether the test data is held by the respective memory devices in a correct manner.
|
