METHOD FOR MEASURING ALIGNMENT ACCURACY OF ALIGNER AND METHOD FOR MEASURING POSITION

摘要

PURPOSE:To make it possible to use one and the same wafer repeatedly and to eliminate a necessity to newly form a pattern for measurement which is the same one as used in the first exposure when measurements are conducted repeatedly and to make measurements rapidly, in a method for measuring an alignment accuracy of an aligner. CONSTITUTION:On a wafer, a diffraction grating 26 by the wafer itself and a diffraction grating 28 by resist are formed. Minus primary diffracted light of the diffraction grating 26 by the wafer itself and minus primary diffracted light of the diffraction grating 28 by resist are detected and then an alignment accuracy of an aligner is measured from a movement position of the wafer for which the diffracted lights are detected.