| 摘要 |
PURPOSE:To provide a mounting board easy in positioning of a semiconductor element and a die-bonding method. CONSTITUTION:A thermoplastic layer 3a is formed by fusing a sheet-shaped thermoplastic sheet, where a section on which each semiconductor element 4a-4e are mounted is made nearly the same shape as that of each semiconductor element, onto the top of the body of a mounting board. Semiconductor elements 4a-4d are mounted on this thermoplastic layer 3a, and the thermoplastic layer 3a is fused by heating a semiconductor package 1, whereby the semiconductor elements 4a-4b are die-bonded to a semiconductor package 1. That is, a thermoplastic layer 3a, where several sections on which the semiconductor elements 4a-4b are mounted are made in nearly the same shapes as those of the several rears of each semiconductor element 4a-4d, is used as a binder for die-bonding. |
