发明名称 RESIN INJECTION MOLDING METHOD
摘要 PURPOSE:To contrive to reduce mold cost and, at the same time, to enhance working efficiency by a method wherein one mold is used during both the working process of the performing of mat and the resin pouring process into a formed article. CONSTITUTION:Mat 19, which is heated up to about 100-110 deg.C and has the predetermined dimension, is placed above a mold 1 and then moved between the mold 1 and a mold 2 so as to be formed by clamping the molds by moving the mold 1 towards the mold 2. After that, resin is poured through a resin passage 12 in the molds. After the hardening of the resin, the mold are opened so as to take a molded article out of the molds.
申请公布号 JPH0687128(A) 申请公布日期 1994.03.29
申请号 JP19920239499 申请日期 1992.09.08
申请人 ISEKI & CO LTD 发明人 IMAMURA HIDEKAZU;TAKIMOTO HIDEO
分类号 B29B11/12;B29C39/10;B29C45/14;B29K105/08;(IPC1-7):B29C39/10 主分类号 B29B11/12
代理机构 代理人
主权项
地址