发明名称 DEVICE FOR SOLIDIFYING THERMOSETTING RESIN BY COOLING
摘要 PURPOSE:To prevent leakage of resin liquid from spaces between damming plates, a cooling drum and a rolling roll. CONSTITUTION:A device comprises a cooling drum 2 to be rotated having a cooling means 4 inside thereof, a rolling roll 3 to be rotatably brought into contact with the periphery of the cooling drum 2 for rolling a resin liquid 1 supplied on the periphery of the cooling drum 2 to make it thin so as to stick to the periphery of the cooling drum 2, a pair of damming plates 16 whose bottom end faces are slidably in contact with the upper periphery of the cooling drum 2 with fast sticking and whose side end faces are slidably in contact with the periphery of the rolling roll 3 with fast sticking being arranged in both ends of the cooling drum 2 in the axial direction, and a resin liquid supply pipe 14 for supplying the resin liquid 1 having high temperature on the periphery of the cooling drum 2 between the damming plates 16. Sealing property among the damming plates 16, the cooling drum 2 and the rolling roll 3 can be heightened.
申请公布号 JPH0691643(A) 申请公布日期 1994.04.05
申请号 JP19920243933 申请日期 1992.09.14
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SHITOOKA FUSAKI;TAKEDA HIROSHI
分类号 B29B13/04;B29K101/10;(IPC1-7):B29B13/04 主分类号 B29B13/04
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