| 摘要 |
PURPOSE:To reduce inductance of a power-supply interconnection and a grounding interconnection by a two-layer structure package, to lower the production cost of the package and to lower the thermal resistance of a device. CONSTITUTION:A conductor layer (a bed) 16 is formed in the central part on one main face of an insulating substrate. A ring-shaped power-supply conductor layer 11 is formed so as to surround the circumference of the conductor layer 16. A plurality of power-supply interconnections 11' are formed radially from the outer circumferential part of the power-supply conductor layer 11. Signal interconnections 12 and grounding interconnections are formed between the individual power-supply interconnections 11'. A grounding conductor layer is formed on the whole of the other main face of the insulating substrate. The conductor layer 16 and the grounding conductor layer as well as the grounding interconnections and the grounding conductor layer are electrically connected respectively by through holes. |
