| 摘要 |
PURPOSE:To manufacture a resin-sealing mold suitable for the resin-sealed type integrated circuit in a short period at low cost even if the circuit is a different type/small lot production. CONSTITUTION:The mold manufacturing method is composed of a process in which a mold releasing agent is applied to the surface of a base material 50 having protruding parts 50A formed by copying the surface of a resin-sealed type integrated circuit, a process in which a metal layer 11A is formed on the surface of the base material 50 where a mold-releasing agent is applied, a process in which a supporting member 11B, which supports the metal layer 11A by feeding metal material to the surface of the metal layer 11A, is formed, and a process in which a chase block 11 is molded by releasing the supporting member 11B from the base material 50 integrally with the metal layer 11A. |
