发明名称 |
Hermetically packaged HDI electronic system |
摘要 |
A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner contact points and a set of outer contact points bridging a seal ring that comprises either a solder seal or a weldable seal for the hermetic package lid. The outer contact points may be directly connected to a leadframe. The leadframe leads, after severing, can be directly attached to a printed circuit board.
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申请公布号 |
US5315486(A) |
申请公布日期 |
1994.05.24 |
申请号 |
US19930073250 |
申请日期 |
1993.06.07 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
FILLION, RAYMOND A.;KORNRUMPF, WILLIAM P.;BERNARD, EDWARD S. |
分类号 |
H01L23/02;H01L23/057;H01L23/10;H01L23/12;H01L23/13;H01L23/50;H01L23/538;H01L25/04;H01L25/18;(IPC1-7):H01L23/053;H05K1/16;H01L23/055 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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