发明名称 PACKAGING STRUCTURE OF SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To partially reinforce a film carrier having flexibility by building a layer of a reinforcing material to arrest flexibility around the resin cladding and on the cladding itself of the film carrier which comprises two or three highly flexible layers. CONSTITUTION:An opening 4a is formed in a preset part of a flexible film 4, upon which a group of lead wires 3a are formed with a conductor wiring 3 and part of it extending to the opening 4a, thereby forming a two-layer film carrier 9. Here, the size of the opening 4a is formed slightly larger than that of a semiconductor element 1 and, onto the opposite side of the surface on which this semiconductor 1 is mounted, a reinforcing material 6 having an opening 6a which is larger than that opening is glued with an adhesive 7 and fixed. As a result, high dimensional stability and improved flatness are obtained at the reinforced part.
申请公布号 JPH06168985(A) 申请公布日期 1994.06.14
申请号 JP19920320102 申请日期 1992.11.30
申请人 SHARP CORP 发明人 ISHII TOSHIAKI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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