Circuit board mounting process

摘要

The circuit board (1) has contact points (2) for the corresponding contacts (7) of electronic components (6) which are to be stuck on the board (1).A separating foil (4) is put on the circuit board (1). The foil (4) is then removed from the contact points (2). A solder material (5) is put on the circuit board (1). The components (6) are positioned with their contacts (7) on the contact points (2). The solder material (5) is then heated to melting point.