| 摘要 |
<p>PURPOSE:To allow judging of the quality of an adhesive layer directly after mounting while real-time finding a detective product. CONSTITUTION:This mounting device is provided with a mounting head 10 pressing a semiconductor chip 1 on a mounting substitute 3 through an adhesive layer 2, a position sensor 13 detecting a position of the mounting head 10 in a pressure process and a quality judging part 19 judging the quality of the adhesive layer 2 from the position detected by this position sensor 13. Since in this constitution the quality of the adhesive layer 2 is made to be judged from the position detected by the position sensor 13, the quality of the adhesive layer 2 can be judged directly after mounting without taking out a product from a mounting device while real-time finding a defective product.</p> |
