| 摘要 |
PROBLEM TO BE SOLVED: To obtain a module capable of easily performing alignment at an optical coupling position between incident light on a photodetector part and the photodetector part, and realizing miniaturization and high-frequency signal transmission by fixing a photodetctor on the side surface of a control part substrate. SOLUTION: This module is equipped with an optical element (receiving optics array) 11, a current control part 12 constituted to be made into IC on the control part substrate (substrate for amplifier) 13, and a housing where the photodetector array 11 and the control part 12 are housed, and the photodetector array 11 is fixed on the side surface 13a of the substrate 13. Namely, in this module, the photodetector array 11 is directly fixed on the substrate 13 whose side surface 13a is made an inclined surface, so that positional deviation caused at a fixing stage is reduced. Since the array 11 is directly fixed on the inclined surface 13a of the substrate 13, a wiring between the array 11 and an amplifier 12 is made short in length. Since a carrier where the substrate 13 and the array 11 are fixed is not required, a case is made low in height. |
