| 摘要 |
PURPOSE:To provide a method of manufacturing semiconductor device whose lead terminals are hardly deformed when they are sheared off and provide a lead frame thereof. CONSTITUTION:The lead terminal connecting part 15 connecting the base end parts of the juxtaposed lead terminal 13 group is connected to an outer frame 10b through the intermediary of zigzag supporting member 16 so that when the lead terminals 13 are sheared off along a cut line CL, the terminal residual part including the lead terminal connecting part 15 after the cutting off step may be elastically displaced upward to make the gaps between the cut off surfaces of the lead terminals 13. Accordingly, later, even if a lead frame is deformed by external force, the cut off surfaces of the lead terminals 13 will not be brought into contact with one another thereby enabling the deformation of the lead terminals 13 to be avoided. |
