| 摘要 |
PURPOSE:To obtain a wiring pattern having excellent dimensional accuracy, and flat and sharp surface by providing a wiring layer consisting of a wiring pattern and high purity easily sinterable alumina, is provided on a high purity easily sinterable alumina layer. CONSTITUTION:A high purity easily sinterable alumina layer 3 is formed by applying paste 11, consisting of high purity easily sinterable alumina, on the surface of a calcined ceramic substrate 1. Then, after the conductive paste 12, consisting of W and Mo metal powder, has been screen-printed on the polished surface of the high purity easily sinterable alumina layer 3 in a dried up state, paste 13 consisting of high purity easily sinterable alumina is applied, polished after dried up, and a wiring layer 8, consisting of a wiring pattern 5 and a high purity easily sinterable alumina 6, is formed. Lastly, the board, provided with the wiring layer consisting of the wiring pattern 5 and the high purity easily sinterable alumina 6, is baked and a ceramic wiring board is obtained. |
