SEMICONDUCTOR SEALING MOLD

摘要

PURPOSE:To easily cope with the position change of a specified pin of a lead frame, in a semiconductor sealing mold for resin-molding a semiconductor element. CONSTITUTION:On a plurality of parts of one upper mold 1 forming a cavity 3, insert pins 7 and insert pins 8 for substitute are so arranged that the positions can be mutually changed. The end surface 7a of the insert pin 7 faces the inside of a cavity 3 and forms a mark 9 designating a first pin 6 of a lead frame 5. The end surface 8a of the insert pin 8 faces the inside of the cavity 3 and coincides with the inner surface of the cavity 3.