PHOTOCOUPLER PACKAGE

摘要

The invention provides a photocoupler package. The photocoupler package includes a light-emitting diode (LED) mounted on a first lead frame, electrically connected to the first lead frame. A photodetector is mounted on a second lead frame, electrically connected to the second lead frame. A first insulating material is disposed on the first lead frame, surrounding the LED. A second insulating material is disposed on the second lead frame, surrounding the photodetector. A third insulating material encapsulates the first insulating material and the LED. A third insulating material also encapsulates the second insulating material and the photodetector. This photocoupler possesses high photocoupling efficiency, small volume, and superior high-isolation capability.

主权项

1. A photocoupler package, comprising:
a light-emitting diode (LED) chip mounted on a first lead frame, electrically connected to the first lead frame; a photodetector chip mounted on a second lead frame, electrically connected to the second lead frame; a first insulating material disposed on the first lead frame, surrounding the LED chip; a second insulating material disposed on the second lead frame, surrounding the photodetector, wherein the first insulating material and/or the second insulating material has high-isolation capability; a third insulating material encapsulating the first insulating material and the LED chip, wherein the third insulating material also encapsulates the second insulating material and the photodetector chip.