| 摘要 |
PURPOSE:To provide a method for manufacturing wiring boards improved in reliability of wiring patterns and interlayer insulation. CONSTITUTION:A synthetic resin insulation layer 7 and a photosensitive resin layer 8 are piled up on a base substrate 6, and this laminate is photoetched into patterns 7', 8'; then, a conductive metal is deposited over the patterned faces 7', 8', and the photosensitive resin pattern 8' is selectively melted away, and a metal deposited film 9b on its face is peeled off to form a wiring pattern 9a almost flush with the synthetic resin insulation patterned face 7'. Similarly, the following steps are repeated: patterning by photoetching of a synthetic resin insulation layer-photosensitive resin layer laminate, film deposition of a conductive metal onto this patterned face, melt-away of a photosensitive resin layer, and formation of wiring patterns by peeling-off of a metal deposited film on a photosensitive resin layer along with this melt-away. |
