发明名称 |
Semiconductor device and a process for making same having improved leads |
摘要 |
A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package and an outer lead located outside the package, the leads being arranged in a line at a predetermined pitch, and the semiconductor element being electrically connected to the inner lead of each of the leads, wherein each side edge of each of the outer leads is flat.
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申请公布号 |
US5343615(A) |
申请公布日期 |
1994.09.06 |
申请号 |
US19920853798 |
申请日期 |
1992.03.19 |
申请人 |
FUJITSU LIMITED |
发明人 |
SONO, MICHIO;KUBOTA, AKIHIRO;KASAI, JUNICHI;YOSHIMOTO, MASANORI;MASAKI, KEIICHI |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01R43/00;B29B13/00 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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