| 摘要 |
This component (1) comprises a mesa (2) formed at the surface of a semiconductor substrate (3), the substrate corresponding to a first electrode and the peak of the mesa corresponding to a second electrode of the component. According to the invention, it comprises on one of its lateral regions a connection region comprising in its surface a wiring pad (11) formed on an insulating substrate (9) with a low dielectric constant, such as a glass, substituted for the semiconductor substrate (3) in this connection region, this wiring pad being connected by a narrow conductive link (12) to the surface (10) of the peak of the mesa in such a way as to connect these two elements electrically. The connection between the wiring pad (11) and the circuit in which the chip is connected can thus be carried out by a wire (17) having a diameter considerable greater than the diameter of the mesa, which allows this operation to be carried in an industrial manner by means of conventional transfer and connecting machines. <IMAGE> |
