发明名称 PACKAGING STRUCTURE FOR ELECTRONIC PART
摘要 PURPOSE:To reduce the number of connectors and to transmit a signal at a high speed by prolonging a signal pin of a package so as to penetrate an opening part, of a power source supply base board and so as to be directly connected with an external connecting means. CONSTITUTION:A multichip package 100 is provided with a power source pin 101, a gland pin 102, and a signal pin 103, which is longer than the power source pin 101 and the gland pin 102. The pin 103 penetrates through an opening part, 109, which is pierced in the corresponding position to a gland contact 114 for a coaxial cable, of a printed wiring board 106 so as to be connected with a central contact 113. Additionally, the pin 103 is connected with a coaxial connector 111 via the contact 114, so that the number of connectors transmitting a signal is reduced to 1 and high speed transmission is achieved. On the other hand, a gland pin 202 is longer than a power source pin 201 by total thickness of a power source plate 204 and an insulating plate 205, while each of the pins is installed in the package 100 via a spring 203, so that the connection with a feeder plate 207 is ensured. Alternatively, these two constitution can be combined with each other.
申请公布号 JPH06325839(A) 申请公布日期 1994.11.25
申请号 JP19930101689 申请日期 1993.04.28
申请人 NEC CORP 发明人 NISHIYAMA TOMOAKI
分类号 H01R13/17;(IPC1-7):H01R23/68;H01R17/04 主分类号 H01R13/17
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