CERAMIC CIRCUIT BOARD AND MANUFACTURE THEREOF

摘要

PURPOSE:To avoid the rolling up or releasing of a circuit pattern on a surface layer during collective sintering step by a method wherein the sinter starting temperature of a conductive paste formed on a surface layer is specified to be higher than that of ceramic green sheets. CONSTITUTION:Not yet baked ceramic green sheets whereon a circuit pattern is formed of a conductive paste are laminated and collectively baked to form a ceramic board. At this time, the sinter starting temperature of the conductive paste formed on the surface layer is specified to be higher than that of the ceramic green sheets. Through these procedures, the board surface is sintered earlier than the conductive paste so that the conductive paste may be sintered after sufficient strength is given to the board surface to suppress the contraction of the conductive paste by the board surface thereby enabling the rolling up or releasing of the circuit pattern to be avoided.