| 摘要 |
PURPOSE:To prevent microcracks, which occur at the interface between metal and ceramic, by adding cavity molding materials such as high polymers to the conductive paste consisting of metallic particles and organic vehicles and scattering them at baking. CONSTITUTION:Silver, as a conductor metal for a via hole, and polystyrene, as a cavity molding material, and silver, as a metallic particles, are applied, and the silver and organic vehicles are mixed, and further polystyrene is added as a material for molding a cavity 30vol.% or under. Hereby, the occurrence of microcracks at the interface between metal and an insulator can be prevented after baking and heat treatment while maintaining resistivity and high reliability. |
