| 摘要 |
The invention relates to the field of microelectronics and electrical engineering. The process comprises the following stages. In the first stage, the coating is kept at room temperature for a time interval from 20 s to 1 hour, depending on the type of polymeric coating. In the second stage, the coating is kept at an elevated temperature under above-atmospheric pressure adequate for suppressing the development of microcracks in such a time interval that, while achieving predetermined protective properties, no thermal degradation of the polymeric coating takes place. In the third stage, the cooling of the coating to room temperature is performed. According to the invention, the above-atmospheric pressure is generated in the first stage and maintained in the cooling stage. The apparatus includes a hermetic high-temperature chamber (13), which is connected to a high-pressure line (8) and is provided with hatches (14, 15) for loading and unloading a product. The chamber (13) is equipped with a heater (24). Ahead of the high-temperature chamber (13) there is arranged a hermetic chamber (1) for the drying of the product at room temperature, which chamber (1) is in connection with the chamber (13) and is connected to the high-pressure line (8). After the high-temperature chamber (13) there is arranged in the direction of movement of the product a hermetic chamber (25) for the cooling of the coating, which chamber (25) is connected to the high-pressure line (8) and is connected to the chamber (13). The invention can be used in the production of microcircuitry and also for producing thin polymeric insulating coatings. <IMAGE>
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