| 摘要 |
PURPOSE:To enhance the thermal hysteresis characteristics by bonding the rim part of silicon sensor chip to a substrate through a ceramic adhesive when a ceramic substrate and a metal substrate are employed. CONSTITUTION:When a ceramic substrate 31 and a metal substrate 21 are employed, the rim part 24 of a silicon sensor chip 21 is bonded to a substrate 31 through a ceramic adhesive layer 30. Coefficient of thermal expansion of silicon is 2.6X10<-6>/ deg.C and that of the ceramic substrate 31, e.g. alumina, is about 4.0X10<-6>/ deg.C. Since the coefficients of thermal expansion are close each other, stress due to the difference thereof is reduced. When a spacer is provided in a region of the substrate 31 corresponding to the lower part of the mass part 23 of silicon sensor chip 21, residual force is prevented from being generated at the diaphragm part 22 due to the weight of the mass part 23. |
