| 摘要 |
PURPOSE:To lessen a semiconductor photodetector in number of component parts by a method wherein an optical axis aligning operation is dispensed with in an assembly process. CONSTITUTION:A V-shaped groove 1, is cut in an end face incidence-type semiconductor photodetector 1 provided with a optical waveguide layer 1b and a light absorbing region 1d, the photodetector 1 is mounted inside a stem 3, and an electrode 1c is boned to an external lead 4 with a wire. The element wire 2. of an optical fiber 2 where a slide ring 5 is fixed is inserted into the opening of the stem 3, disposed in the V-shaped groove 1f of the photodetector 1, and fixed to the semiconductor photodetector 1 with resin. The slide ring 5 and a cap 6 are fixed to the stem 3.
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