发明名称 Semiconductor storage device (memory)
摘要 In a semiconductor storage device, the separation of the bit lines (15) is larger than the separation of the word lines (4), and a memory node contact (17) is arranged in each rectangular surface which is enclosed by the bit lines (15) and the word lines (4). The separation between the mid-points of adjacent memory nodes (17) and the separation between the mid-points of a bit line contact (16) and an adjacent memory node contact (17) are both larger than the separation of the word lines (4). By virtue of this structure, the planar surface area per unit storage cell can be increased, the positioning margin or overlap margin between the memory node (11) and the memory node contact (17) can be broadened, a short circuit between the bit line (15) and the memory node contact (16) is prevented, and a memory cell structure with high production yield and high reliability can thereby be obtained. <IMAGE>
申请公布号 DE4430804(A1) 申请公布日期 1995.03.02
申请号 DE19944430804 申请日期 1994.08.30
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 EIMORI, TAKAHISA, ITAMI, HYOGO, JP
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L27/108;G11C11/401 主分类号 H01L27/04
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