LEAD FRAME FOR SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING SAME

摘要

PURPOSE:To miniaturize a semiconductor device by simplifying a lead frame and to enhance the efficiency of a manufacturing process using the lead frame. CONSTITUTION:A lead frame 1 is provided with one piar of frames 2a which are arranged in parallel and with a plurality of connecting frames 2b which connect the pair of frames 2a. In addition, the connecting frames are provided with a plurality of lead electrodes 4 which are formed so as to be extended in parallel with the pair of the frames.