| 摘要 |
PURPOSE: To provide an electronic element having highly reliable electric conductivity, and a conductive adhesion structure providing a mechanical bond. CONSTITUTION: Flexible material layers 23, 25 are provided between an integrated circuit 11 and a board bonded through an anisotropic adhesive consisting of an insulating adhesive 22 and conductive particles 21. In an embodiment, one bonding pad is coated with a metallic layer 23 which is significantly softer than the metal forming the conductive particles 21A and outsize conductive particles are sunk into the soft metal layer 23. In another embodiment, one bonding pad is arranged on the adhesive layer 25 exhibiting sufficient viscosity at the temperature for forming contact and the bonding pad 15 can turn, depending on the pressure being applied from an outsize conductive particle 21D. |
