发明名称 |
Wiring method and wiring apparatus |
摘要 |
A wiring apparatus includes a preprocessing unit for splitting a starting portion of splitting coated parallel twin wires composed of two coated single wires joined together in parallel form and fed from a wire rounding member into the two coated single wires and removing a part of a coating of each of the coated single wires split, and a bonding unit for separately bonding portions of the two coated single wires from which coatings have been removed to two terminals provided on a body on which the coated parallel twin wires are to be arranged.
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申请公布号 |
US5400503(A) |
申请公布日期 |
1995.03.28 |
申请号 |
US19930090275 |
申请日期 |
1993.07.13 |
申请人 |
FUJITSU LIMITED |
发明人 |
KOMORIYA, HITOSHI;YABUKI, AKIHIKO;OIKAWA, KOUICHI |
分类号 |
H05K3/10;H01L21/00;H01L21/308;(IPC1-7):H01K3/10;B23P19/00 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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