发明名称 Wiring method and wiring apparatus
摘要 A wiring apparatus includes a preprocessing unit for splitting a starting portion of splitting coated parallel twin wires composed of two coated single wires joined together in parallel form and fed from a wire rounding member into the two coated single wires and removing a part of a coating of each of the coated single wires split, and a bonding unit for separately bonding portions of the two coated single wires from which coatings have been removed to two terminals provided on a body on which the coated parallel twin wires are to be arranged.
申请公布号 US5400503(A) 申请公布日期 1995.03.28
申请号 US19930090275 申请日期 1993.07.13
申请人 FUJITSU LIMITED 发明人 KOMORIYA, HITOSHI;YABUKI, AKIHIKO;OIKAWA, KOUICHI
分类号 H05K3/10;H01L21/00;H01L21/308;(IPC1-7):H01K3/10;B23P19/00 主分类号 H05K3/10
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