发明名称 POWER-SUPPLY APPARATUS
摘要 PURPOSE:To provide a power-supply apparatus which prevents a soldered connection from being burned out by the degradation of the connection without a rise in costs. CONSTITUTION:A power component is mounted on a printed-circuit board 11 in which an etched-pattern copper-foil circuit 12 has been formed on one side. An insertion through hole 14 which is passed between both faces of the printed-circuit board 11 is made in a part into and through which a lead wire 13 is inserted and passedin the printed-circuit board 11, and a connecting part 15 which is formed of a copper-alloy solder paste is formed on the inner face of the insertion through hole 14 so as to be connected to the etched-pattern copper-foil circuit 12. The lead wire 13 is inserted into, and passed through, the insertion through hole 14, and the lead wire 13 is connected, by solder 16, electrically and mechanically to the connecting part 15 and to the etched-pattern copper-foil circuit 12, a component for control is mounted on, and attached to, the printed-circuit board by a face mounting operation or the like without inserting and passing the lead wire into and through the insertion through hole or without forming the insertion through hole in advance. When the solder is degraded due to secular use, the life of a control means 4 is shorter than the life of a power supply means.
申请公布号 JPH0787743(A) 申请公布日期 1995.03.31
申请号 JP19930229159 申请日期 1993.09.14
申请人 TEC CORP 发明人 SUZUKI SHIGESADA;MATSUDA FUSAO
分类号 H02M7/04;H02M7/217;H05B41/24;H05K3/34;H05K3/40;(IPC1-7):H02M7/04 主分类号 H02M7/04
代理机构 代理人
主权项
地址