发明名称 PACKAGE FOR ACCEPTING ELECTRONIC PART
摘要 PURPOSE: To provide a package for an electronic part satisfying requirement regarding quality and cost, particularly an automobile electronic part. CONSTITUTION: In the package, the electronic part is installed onto a printed board 2, and printed board 2 itself is coupled firmly with a metal plate 1. A moisture-tight case is formed for the printed board 2 and for a part by completely sealing (molding) the printed board 2 and the part by a proper synthetic-resin material and combining the sealing section 5 of the peripheral surface of the printed board with the metal plate 1 in a positive motion manner.
申请公布号 JPH0786768(A) 申请公布日期 1995.03.31
申请号 JP19940214164 申请日期 1994.08.05
申请人 TEMITSUKU TELEFUNKEN MICROELECTRON GMBH 发明人 KURAUSU SHIRUMERU
分类号 H01R24/00;B60R16/02;B60R16/023;H01R12/71;H05K1/05;H05K3/28;H05K5/00;H05K7/14;(IPC1-7):H05K7/14;H01R23/02;H01R23/68 主分类号 H01R24/00
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