| 摘要 |
PURPOSE:To secure a semiconductor substrate flatly without contaminating the surface thereof by forming a positive resist layer on a supporting body, heating the main surface of an opaque semiconductor substrate while applying pressure onto the resist layer, exposing the semiconductor substrate from the main rear surface thereof and developing the resist layer. CONSTITUTION:A holding body, i.e., a fixing glass plate 21, and a retaining glass plate 31 are spin coated with positive resists 22, 32. An opaque semiconductor substrate 11 is then applied to the resist 22 while opposing the main surface side 14 thereto. It is further spin coated with a positive resist 23. The semiconductor substrate 11 is then sandwiched between the fixing glass plate 21 and the retaining glass plate 31 while opposing the rear surface side 15 of the semiconductor substrate 11 to the resist 32 on the retaining glass plate 31. The laminate is then pressed and baked. It is then exposed from the rear side and developed thus removing the resist entirely except the resist region 24. This method allows flat securing of the semiconductor substrate and the fixing glass plate without leaving any bubble therebetween. |
